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Microelectronic Sub-Assembly Manufacturing Wafer Dicing Die Attach Wire Bonding Heavy Gauge Wire Bonding Encapsulation & Dispensing

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HOME MARKETS Core Markets Served MANUFACTURING Microelectronic Sub-Assembly Manufacturing Wafer Dicing Die Attach Wire Bonding Heavy Gauge Wire Bonding Encapsulation & Dispensing Test & Inspection Test & Inspection and FA, REL & ELT Test & Inspection and Failure Analysis Reliability and ELT Super UV Testing RESOURCES Technical Articles Brochures and Application Technical Data Sheets Video Archive ABOUT SMART SMART Facility Location Industry Partners Environmental & Industry Certifications (Copy) Contact Us

Heavy Gauge Wire Bonding/CMM Article HOME/Fierce Digital Ad HOME/Fierce Newsletter Ad 1 HOME/Fierce Newsletter Ad 2 HOME/Fierce Email Blast 2023-SUV-Campaign SMART Microsystems Privacy Policy

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• Wire Bonding • Super UV Testing Industry Certification
• Heavy Gauge Wire
Bonding
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Dispensing

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SMART Microsystems Ltd.

141 Innovation Drive,

Elyria, OH 44035,

USA

440-366-4203 info@smartmicrosystems.com

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