Die attach is a critical step in the packaging of microsystems and MEMS sensors that can impact other packaging and assembly processes. For example, accuracy and repeatability requirements for die placement and die height can affect other package assembly processes such as wire bonding as well as the adhesive and encapsulation materials used. The die attach capabilities and expertise at SMART Microsystems support the process development, testing, and manufacturing of sub-assemblies designed by our customers allowing them to quickly realize a microelectronic package assembly solution for their products. For additional information you can call or send us an email to discuss your die attach needs. 

DIE ATTACH SPECIFICATIONS
•   Epoxy die attach, flip chip, sintering, eutectic attach, multi-chip module
•   X/Y placement accuracy: ±7μm @ 3 sigma
•   Theta placement accuracy: ±0.15° @ 3 sigma
•   Die thickness down to 20μm
•   Speed: up to 7,000 units per hour
•   Integrated dispense
•   Material presentations: grip ring and film frame (for wafers up to 300mm), waffle pack, Gel-Pak
•   Substrates: FR4, ceramic, BGA, flex, boat, lead-frame, waffle pack, Gel-Pak, JEDEC tray

SOLDER REFLOW SPECIFICATIONS
•   Accommodates 18” wide boards and substrates and maximum clearance of 2.2”
•   Tunnel length of 105” includes 9 heating zones each with independently controlled top and bottom heaters
•   Maximum temperature 450 °C with PID temperature control ± 1°C per zone and ± 3° cross-belt temperature tolerance
•   Internal controlled cooling zone 30” length includes 3 cooling zones with top and bottom cooling
•   Balanced flow of air or nitrogen capable of producing controlled atmospheres less than 25 ppm O2
•   CPK & SPC data and alarm logging with timed download and profile printout capability