Wafer Dicing
• Max wafer size: 6” diameter (round or square) and
• up to 10mm thick
• Utilizes tape rings or grip rings to hold materials
• Performs cutting, dicing and scribing operations
• Spindle speeds: 3,000 to 60,000 rev/min
• Resolution of the axes:
---- X Axis – 0.1 mm
---- Y Axis – 100 nanometres
---- Z Axis – 100 nanometres
---- Theta axis: 6 million lines; 0.0004 ° resolution
• Dicing speed: 0.1-500mm/sec

Wafer Inspection
• Stage accommodates up to 200 mm wafers
• Typical image size 2752 x 2200 pixels with 4.54 µm
• resolution per pixel with repeatability ± 2 µm
• Brightfield/Darkfield Optics at 2.5x and 5x with high
• spatial resolution camera imaging 19 fps
• Automatic reporting generated includes defect
• density maps and defect count histograms
• Software includes Die Yield Analyzer for patterned
• wafer recognition
• Programmable automatic quantification and
• qualification of features of interest
• Programmable automatic and manual image capture • parameters of focus, lighting, magnification, and
• movement

Die Sort
• Die size: ≥0.17mm square and up
• Die thickness: ≥0.020mm
• Max wafer size: 300mm
• Videoscope alignment uses either pattern
• recognition or vision system two point alignment
• Blade capacities: 50mm to 76.2mm
• Range of materials includes Alumina, BGA and
• CBGA moldings, Ceramic, Glass, Lead, Zirconate
• Titanate, Fibre Board and Silicon