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SMART Microsystems’ William Boyce Discusses “Considerations for an Effective MEMS Die Attach Strategy” in the Fall Issue of the MEPTEC Report

Die attach method is in every way fundamental to MEMS product design. Unfortunately, during the early product development and design phase of a new MEMS product, very rarely is the die attach strategy given enough consideration. Although there are many die attach methods available (thermal compression bump bonding, brazing, and soldering) the focus of this article will be one of the most popular methods: adhesive die attach. In the realm of adhesive die attach there are many basic properties that can drastically affect the product function or production process.

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UPCOMING EVENTS

• SENSORS Midwest, October 3
• IMAPS International, October 9
• MEPTEC 2017 Semiconductor Packaging

SMART Microsystems’ William Boyce Discusses “Fixture Development: A Key Element in MEMS Sensor Production” in the June Issue of TAP TIMES

Developing new MEMS sensors products can be challenging. The market opportunities are widely varied and the applications tend to be highly specialized. These unique applications tend to involve complex sub-assemblies. As a result, fixture development becomes a key element in the product development cycle. Fixture development for early prototypes is a pivotal point in the product development cycle because these prototypes need to be representative of the final product. Balancing the requirements for precision fixtures against a proposed timeline commitment can be challenging...

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SMART Microsystems’ William Boyce Discusses “Failure Analysis - A Tool for Developing New MEMS Sensors” in the Summer Issue of the MEPTEC Report (see page 24)

In the world of MEMS sensors new product development, failure analysis is a tool that can reduce costs and accelerate time to market. Failure analysis can be used to achieve a better understanding of the behavior of a MEMS sensor product after being stressed by the conditions from its application environment. In a thoughtful design, the environmental conditions in which a product is intended to function need to be considered carefully. Once these conditions have been determined, a life test profile is defined in order to simulate the environmental conditions in which the product will need to survive. When the life test profile is completed...

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