SMART Microsystems’ William Boyce Discusses “Considerations for an Effective MEMS Die Attach Strategy” in the Fall Issue of the MEPTEC Report

Die attach method is in every way fundamental to MEMS product design. Unfortunately, during the early product development and design phase of a new MEMS product, very rarely is the die attach strategy given enough consideration. Although there are many die attach methods available (thermal compression bump bonding, brazing, and soldering) the focus of this article will be one of the most popular methods: adhesive die attach. In the realm of adhesive die attach there are many basic properties that can drastically affect the product function or production process.

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SMART Microsystems' William Boyce Discusses "Achieving Wire Bond Interconnect Process Success" in the November Issue of TAP TIMES

Over 15 trillion interconnects are formed by wire bonding each year. The vast majority of them are gold ball bonds, but aluminum wedge and ribbon bonding should not be forgotten. Wire bonding is generally considered the most cost-effective and flexible interconnect technology used to assemble semiconductor packages. So why is it that when wire bonding is mentioned as an interconnect strategy in a new development project, it raises cause for concern? Wire bonding is not a process to be taken lightly. For long term success, a robust wire bond interconnect needs a solid process.

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SMART Microsystems’ William Boyce Discusses “Failure Analysis - A Tool for Developing New MEMS Sensors” in the Summer Issue of the MEPTEC Report (see page 24)

In the world of MEMS sensors new product development, failure analysis is a tool that can reduce costs and accelerate time to market. Failure analysis can be used to achieve a better understanding of the behavior of a MEMS sensor product after being stressed by the conditions from its application environment. In a thoughtful design, the environmental conditions in which a product is intended to function need to be considered carefully. Once these conditions have been determined, a life test profile is defined in order to simulate the environmental conditions in which the product will need to survive. When the life test profile is completed...

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