News
Bottomnav
Bottomnav Home Bottomnav Capabilities Bottomnav Markets Bottomnav Services Bottomnav Applications Bottomnav News Bottomnav About Us Bottomnav
Bottomnav

SMART Microsystems' William Boyce Discusses "Product Design for Wire-Bondability" in the Summer Issue of the MEPTEC Report

Wire bonding is a commonly used process to create low-cost and reliable electrical interconnects between semiconductor components and mechanical assemblies. Wire bonding is generally considered the most cost-effective and flexible interconnect technology for microelectronic assembly. It is used to manufacture the vast majority of fully packaged semiconductor products. In fact, over 15 trillion interconnects are formed by wire bonding each year. Different types of wire bonding processes include gold ball bonding, fine gauge aluminum wedge bonding, heavy gauge aluminum wedge bonding, and ribbon bonding. In order to be successful, wire bonding must be properly designed into the microelectronic assembly from the start.

Read Article

Home
Contact Us
item1
item2

UPCOMING EVENTS

• MEPTEC New Generation Flexible
• Sensors Expo and Conference
• IMAPS 2018 - Pasadena
• Sensors Midwest